TSMC To Boost CoWoS Production To 130,000 Monthly By 2026 – Major Advancements Ahead
Taiwan Semiconductor Manufacturing Company (TSMC) is set to significantly enhance its Chip-on-Wafer-on-Substrate (CoWoS) production capabilities in the upcoming quarters. This strategic move aims to ramp up monthly production to an impressive 130,000 units by 2026. As the demand for advanced packaging technologies continues to soar, TSMC’s investment in CoWoS production reflects its commitment to maintaining … Read more